About The Event

Ansys Simulation Solutions
Ansys is the world’s leading provider of design and simulation software for Computer Aided Engineering, with products covering almost every industry and application. The Ansys Workbench platform links more than 75 tools together to provide an integrated suite, and enables ‘Pervasive Simulation’ throughout the product lifecycle, from concept ideation through to manufacturing and operations. In today’s webinar we’ll be focussing on the tools available for electronic product design; for use by electrical and electronics engineers, and mechanical engineers working on products including electronics.

High-Frequency Simulation for Electronics Products Design
Ansys offers ‘Best in Class’ electromagnetic (EM) simulation software for designing and simulating high-frequency electronic products such as antennas, components, interconnects, connectors, ICs and PCBs. This helps to ensure that high-frequency electronic devices meet performance, reliability, and safety standards, and can significantly reduce the time and cost associated with physical testing and prototyping. The solution enables simulation and validation of high-speed channels and complete power delivery systems typical in modern high-performance electronics. It accurately extracts multi-gigabit SERDES and memory buses, providing product sign-off compliance for various designs.

Electronics Thermal Simulation using Ansys Icepak
Ansys Icepak provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent CFD solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. All electronic devices and circuits generate heat during normal operation. Engineering the safe removal of this heat is critical to avoid failures and improve product reliability. With miniaturization and high-speed devices driving this world, thermal management of electronic devices becomes an even bigger challenge which has to be tackled thoroughly with detailed approach and efficient exploration of design space.

Electronics Reliability Analysis using Ansys Sherlock
Ansys Sherlock provides fast and accurate lifetime predictions for electronics products at the component, board and system levels. Reliability is the measure of a product’s ability to perform specified functions in the customer environment over the desired lifetime. The best way to ensure reliability for electronics design is by taking the Physics of Failure (PoF) approach, which uses science (physics, chemistry, etc.) to capture an understanding of failure mechanisms and evaluates useful life under actual operating conditions. Using Sherlock, electronics manufacturers can determine how long it takes for a product to fail, why the failure occurred, and suitable approaches to mitigating the problem.

Target Audience:
This webinar is aimed at Design Engineers, Simulation Specialists and Technical Managers working in the area of electronics product design, where there is a requirement for fast and accurate simulation of high-frequency signals, thermal performance, and mechanical reliability.

Agenda:

Speakers’ Profile:

Dr David Byrne - Manager, Simulation Products, PD Solutions Pte Ltd
David joined PD Solutions in 2007 as the Manager and Senior Consultant for all Simulation Products. He has over 35 years’ experience in developing, using and consulting on FEA, CFD and other simulation solutions in the automotive, aerospace, electronics, semiconductor manufacturing and other related industries. He has worked on various projects in the Asia Pacific region with clients in Taiwan, China, Korea, Singapore, Malaysia, India, Australia, Japan and the USA. He holds a BSc degree in Chemical Engineering, Masters in Electronic Engineering and a PhD in Numerical Modeling of Semiconductor Devices from Swansea University, UK.

Desmond Tan - Regional Technical Manager, Ansys
Desmond has been a Regional Technical Manager for ANSYS and Ansoft since 2004; he joined Ansoft in the year 2000 as a Senior Application Engineer. During his time with Ansoft, he has developed a broad range of applications and designs in many different areas with the customers, such as RF & microwave circuits, wireless communication systems, and SI related products. He has also concentrated on the integration, interoperability and customization of all Ansoft products. Prior to Ansoft, he worked at companies including Agilent, Tech Semiconductor and Chartered Semiconductor as a senior staff engineer in Failure analysis and product engineering for over 10 years. He was primarily involved with optical device, receiver & transmitter chip module, Optocouplers, LEDs, Optical sensors, RAM memory for military, automotive, communication and consumer applications. He earned his 1st class Honors Degree from Glasgow University from Scotland and his Master of Engineering from NTU Singapore.

Subodh Deodhar - Lead Applications Engineer, Ansys
Subodh Deodhar is a Lead Application Engineer at ANSYS India with 17 years of experience in heat transfer, fluid systems & electronics thermal management. He has worked with several Indian and global customers of Ansys for solving thermal management problems using Icepak, Multiphysics, workflow automation & solver customization.

Bharat Panjwani - Regional Technical Manager (ASEAN), Ansys
Bharat Panjwani is associated with Ansys as Regional Technical Manager (ASEAN). He received his MEng degree from NUS, Singapore in Mechanical Engineering. He has worked for Maruti Suzuki, General Electric and John Deere in the past. He has more than eighteen years of professional experience in applying engineering simulation in automotive, Aerospace, defense, electronics components, and industrial equipment domains. He has expertise in the areas of non-linear structural analysis, dynamics, durability, and tribology