Fastrack PRO - Wafer Fab

YIELD IMPROVEMENT FOR INTEGRATED CIRCUITS IN WAFER FAB AND ASSEMBLY

INTRODUCTION
Yield improvement is one of the most critical goals of all semiconductor operations. This course provides an introduction to semiconductor yield and yield management and addresses the main types of yield loss, defects, systematics, and parametric. Participants will also learn about yield loss mechanisms, both in wafer fabrication and during device packaging, and will also be given exposure to yield management methods, including in-line process control, data mining, defect control, and failure analysis.

TRAINING OUTLINE

 1. Introduction
     a. Overview of Semiconductor Manufacturing
     b. Basic Statistics

 

2. Yield Loss Models
     a. Defect Yield Loss: Poisson, Murphy, Seeds, and Bose-Einstein
     b. Systematic Yield Loss
     c. Parametric Yield Loss
     d. Design for Manufacturing (DFM)
     e. Metrology
     f. Test Structures

 

3. Yield Loss Mechanisms
    a. Wafer Fab: Isolation, Gate, Silicide/Contacts, Al BEOL, Cu BEOL
    b. Device Packaging:
           i. Dicing
          ii. Die Attach
         iii. Wirebond
         iv. Solder Bumps
          v. Molding Compound
         vi. Wafer Level Chip Scale Package (WLCSP)

 

 4. Yield Management
     a. Fab Discipline
     b. In-line Process Control
     c. Data Mining:
           i. Electrical Data
          ii. Metrology
         iii. Wafer Maps/Spatial Data
         iv. Correlation Techniques
    d. Statistical Process Control (SPC)
    e. Defect Control
    f. Failure Analysis

 

 

WHO SHOULD ATTEND
Process Engineers, Product Engineers, NPI Engineers, RD Engineers, and Development Engineers who are involved in Semiconductor Test and Assembly and Wafer Fab.

 

DURATION
2 Days (9.00 am – 5.00 pm)

 

TRAINING DATE(S) & VENUE
23 – 24 October 2017 @ PSDC, Penang

 

COURSE FEE
RM2,900/participant (excluding 6% GST). Course fees are HRDF claimable.

 

TRAINER


DR JEFFERY GAMBINO – ON SEMICONDUCTOR

 

COURSE BROCHURE
Click here to download the full brochure.